“School of Nano-Sciences”
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| Paper IPM / Nano-Sciences / 16054 |
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| Abstract: | |||||||||||||
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Effect of sandblasting of the copper electrode structures before deposition of gold thin film for micro electrical
impedance tomography (EIT) system has been studied experimentally. The comparison has been performed on the
unmodified copper electrodes and the sandblasted electrodes before deposition of gold layer, using structural
analysis while their performance in EIT system has been measured and analyzed. The results of scanning electron
microscopy and atomic force microscopy show that the sandblasting of the electrodes results in the deposition of
gold film with smaller grain size and uniformly, comparing to the unmodified structure. The measurement of
impedance shows that the sandblasting will increase the double layer capacitance of electrode structure which
improves the impedance measurement accordingly
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